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Ti etching solution standard, Ti seed layer etching solution

We will etch the Ti film effectively. We have options for standard thin film etching and Ti seed layer etching.

The features of this product are as follows: - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for laminated films such as Cu/Ti and W/Ti. Keywords: wet etching, titanium

Company：Hayashi Pure Chemical Ind., Ltd. Electronic Materials
Price：Other

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Cu seed layer etching solution

For the Cu plating/Cu seed structure, it etches the Cu seed layer with minimal damage to the Cu plating wiring and bumps.

The features of this product are as follows: - There is less thinning of the Cu plating. - There is less surface roughness of the Cu. - It can be applied to various seed layers (from electroless copper plating to sputtered copper). - It supports various methods such as dip, spray, and spin. Keywords: wet etching, copper, plating, seed layer, selective semi-additive method.

Company：Hayashi Pure Chemical Ind., Ltd. Electronic Materials
Price：Other

Chemicals

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